KeXinMaterials

TSMC: Global Semiconductor Wafer Transport Cases

Client: Taiwan Semiconductor Manufacturing Company Industry: Global Semiconductor Foundry Region: Hsinchu, Taiwan (50+ countries) Year: 2026
TSMC: Global Semiconductor Wafer Transport Cases

Challenge

TSMC is the world's largest semiconductor foundry with $100B+ revenue and 50+ countries. They need cases for wafer transport, photolithography components, and metrology equipment transported to fabs, customer sites, and global operations. Cases must: (1) meet IATA + IP65 + ultra-clean + ESD-safe semiconductor standards, (2) survive global wafer transport, (3) protect $5M+ wafer processing equipment, (4) integrate with TSMC supply chain, (5) be reusable 300+ cycles.

Solution

KeXinMaterials provided ultra-clean semiconductor-grade cases with: (1) IATA + IP65 + ISO Class 5 cleanroom + ESD-safe compliance, (2) PP copolymer with ultra-clean and ESD-safe, (3) custom foam for 300mm wafer cassettes, photolithography components, metrology equipment, (4) serialized QR + TSMC secure logistics, (5) 300+ cycle rating. Custom foam for TSMC 300mm FOUP, EUV photolithography modules, ASML metrology equipment.

Result

1,800 cases deployed across 50+ countries. 18 months zero wafer equipment damage. 100% ISO Class 5 compliance. TSMC standardized KeXinMaterials as a qualified semiconductor case vendor.

"TSMC operates in 50+ countries with strict IATA, ISO Class 5 cleanroom, and ESD-safe semiconductor foundry standards. KeXinMaterials cases have proven ultra-clean and ESD-safe performance across our global fab operations. The 300+ cycle reusability supports our ESG goals. They're our standard semiconductor case. — TSMC Global Semiconductor Operations Director"

— Taiwan Semiconductor Manufacturing Company

Project Duration: Ongoing (5-year MSA)
Total Value: $3,000,000
Industry: Global Semiconductor Foundry

Related Resources

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