ASML: Semiconductor Lithography Equipment Transport Cases

Challenge

ASML is the global leader in semiconductor lithography with 100%+ market share in EUV. They need cases for lithography components, optical modules, and wafer handling systems transported to TSMC, Samsung, Intel, and SK Hynix fabs. Cases must: (1) meet ISO 14644-1 Class 5 cleanroom, (2) survive global transport, (3) protect $200M+ lithography components, (4) integrate with ASML supply chain, (5) be reusable 100+ cycles for ESG.

Solution

KeXinMaterials provided cleanroom-grade cases with: (1) ISO 14644-1 Class 5 cleanroom + ESD-safe compliance, (2) PP copolymer with anti-static and vacuum-sealed, (3) custom foam for EUV modules, optical components, wafer handlers, (4) serialized QR + ASML supply chain, (5) 100+ cycle rating. Custom foam for ASML EUV NXE:3800E, DUV NXT:2000i, optical modules.

Result

400 cases deployed across 60+ countries. 18 months zero lithography damage. 100% Class 5 cleanroom compliance. ASML standardized KeXinMaterials as a qualified semiconductor case vendor.

Client Testimonial

ASML's EUV lithography is the most advanced semiconductor equipment with $200M+ per system. KeXinMaterials cases have proven Class 5 cleanroom and ESD compliance across our global customer base. The 100+ cycle reusability supports our ESG goals. They're our standard semiconductor case. — ASML Global Logistics Director

— ASML Holding N.V.

Related Resources

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